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Imaginis-HCXVideo walls for corporates
Imaginis-HCX series respond to nest pitch requirements with 0.9 mm, 1.2 mm, 1.5 mm, LED display solutions. The cabinets are already in 16:9 format to compose screens with standard video and image aspect ratio.
The access to the cabinet is fully from the front for ideal installation on wall or stand alone and maintenance without even touching LED modules. Special treatments are also applied: Nano treatment improves IP rating and product robustness, Inkjet is used in place of masks to increase contrast ratio and viewing angle.
High de nition, super contrast and noise-free features make Imaginis great for any indoor location like TV studios, control rooms, retail, public environments and particularly corporate lounges receptions and conference rooms.
This Led screen series can be used 24/7 with an expected life time in controlled ambient of up to 100,000 hours.
COB SPECIAL LED PACKAGING TECHNOLOGY
COB stands for “Chip On Board”, in which chip is directly bonded onto the board with high precision and is connected to the driving components on the board through the medium. COB can be categorized into front-mounted chip, ip chip, and semi- ip chip.
> Front-mounted chip means electrode and light-emitting surface of the chip are on the same side, and the electrode is connected to the substrate through metal wire bonding.
> The light-emitting side of the ip chip faces up and the electrode side faces down, which means the front-mounted chip is inverted. So it is called “ ip chip”.
> Semi- ip chip generally refers to front mounting for the red-light chip, while blue and green chips are ipped.
FULL FLIP CHIP
Now, there are front-mounted chip, semi- ip chip (eg. R front-mounted chip, GB ip chip) and full ip chip.
> Full ip chip on board is a true chip-level packaging, which does not require wire bonding, and the physical space is limited only by the size of the chip, breaking the pixel pitch limit of the front-mounted chip.
> Each pixel unit of front-mount COB has 5 metal wires and 10 soldering joints, while each pixel unit of ip-chip COB has only 6 metal bonding joints, which e ectively solves the problems of insu cient soldering and broken wires to further improve reliability.
> There is no wire soldering, so the packaging thickness can be further reduced, which can solve the problem of colored, bright and dark lines between modules
COMMON CATHODE
> COB can easily adopt high-integration common cathode drive solution so the RGB will be powered separately, i.e.: driving voltage for red lamp is 2.8V, for blue and green lamps is 3.8V. The voltage and current are accurately distributed to the red, green and blue lamps, then to the cathode of the IC; the forward voltage drop is low, thus the on-state internal resistance is also low.
> The intelligent dynamic energy saving technology helps to eliminate useless power consumption to reduce the comprehensive energy consumption by more than 40%; Solves the cross-board coupling and other problems completely to achieve excellent gray scale performance under low brightness and more delicate gray scale transition; New signal protocol reduces EMI e ectively.
COMPREHENSIVE PROTECTION
Adopt mass transfer technology, whole-board packaging with excellent air tightness
> The front side of the modules is waterproof, dustproof, moisture-proof, and anti-static; the back side of the cabinet reaches IP60.
> Anti-knocking and wipeable: hardness of wall surface is 2H, which is anti-knocking, anti-colllision, and can be wiped directly.
> More reliable without wire soldering: the lamp has no wires, nor exposed lamp foot
Low-Temperature Operation
> Excellent power supply thermal structure design
> Excellent PCB circuit design
> High-luminesce-e ciency LED chip
Migliore rapporto di contrasto per un’esperienza immersiva
Better Contrast Ratio for Immersive Experience
- 160 inches Single Screen UHD or Higher
- Resolution- 3840×2160 or Higher
- 24/7 Operation Hours
- Brightness 750 cd/m2 or Higher
- Contrast Ratio/Dynamic Contrast: 4000:1 / 100M :1 or Higher
